Chairs: Dominique Thomas (STMicroelectronics), Klaus Pressel (Infineon), Rainer Pforr (Zeiss)

Full content duration ~6h

 

a) Global Trends in Microelectronics and how Europe can address them

Joël Hartmann (STMicroelectronics, France) 

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b) FeFET: A versatile CMOS compatible device with game-changing potential

Sven Beyer (GlobalFoundries, Germany)

 

c) RF SOI technologies for 5G and beyond

Yvan Morandini (Soitec, France)

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d) Power electronics trends 2025

Herbert Pairitsch (Infineon, Austria)

 

e) Back side ohmic contact in 4H-SiC Power Devices

Simone Rascunà (STMicroelectronics, Italy) 

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f) Novel Packaging concepts and their potentials for generating energy efficient electronic based systems

Hannes Voraberger(AT&S, Austria)

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g) Advanced High Voltage Passive devices for Automotive and Power applications

Franck Murray (Murata, France)

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h) Innovative Fan-out Wafer Level Package platform for sensor applications

Horst Theuss (Infineon, Germany)​

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i) NIR-sensitive single-photon devices (Silicon photomultipliers and SPADs in custom technologies), for industrial and automotive LIDAR applications

Fabio Acerbi (FBK, Italy)

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j) 3D ToF sensor design and it's application in gesture and object recognition

Sarah Blumenthal (Elmos, Germany)

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k) Stress Reduction in Integrated Hall ICs using a Si Surface Trench

Marc Baumann (TDK-Micronas, Germany) 

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l) Isotropic 3D Hall Sensors

Laurent Osberger (TDK-Micronas, Germany) 

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m) MEMS – pushing the limits

Markus Sonnemann (Bosch, Germany)

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n) Progress in High NA EUV Optics Development for sub-10nm resolution

Lars Wischmeier (Zeiss, Germany) 

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o) Merging of photonics and micro-electronics- Photonics in UK 

Iwan Davies (IQE, UK)

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p) Advanced Developments in the Field of IR Imaging Technologies

Patrick Abraham (Lynred, France)

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