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ESSCIRC ESSDERC 2020

VIRTUAL EDUCATIONALS

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50th European Solid-State Device Research Conference

ESSDERC.png

50th European Solid-State Device Research Conference

ESSCIRC.png

46th European Solid-State Circuits Conference

ESSCIRC.png

46th European Solid-State Circuits Conference

4. WORKSHOP | New 5G integration solutions, and related technologies (from materials to system)

Click on titles to see abstracts and biosketches or go back to Virtual Educationals main page

Chairs: Nadine Collaert (imec) and Stefan G. Andersson (Ericsson)

Full content duration ~6h

 

a) Power efficiency in the next generation of 5G-6G analog front-ends

Antonio Liscidini (University of Toronto, Canada)

 

b) 5G NR and Beyond

Stefan Parkvall (Ericsson, Sweden)

 

c) Digital PLLs For Millimeter-Wave

Bogdan Staszewski (University College Dublin, Ireland)

 

d) Power Amplifiers for 5G mmWave: State of the Art and Future Directions

Harish Krishnaswamy  (Columbia University, USA)

 

e) Flexible channel filtering by CMOS N-path filters in low-GHz Receivers

Bram Nauta (University of Twente, Netherlands)

 

f) Silicon Technology Solutions for 5G and beyond CommunicationsI

Alvin Joseph (GlobalFoundries, USA)

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g) 300mm GaN-on-Si technology and Co-integration with Si CMOS

Han Wui Then (Intel, USA)

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h) BiCMOS integrated circuits for millimeter-wave wireless backhaul

Andrea Mazzanti (University of Pavia, Italy)

 

i) EU project Beyond 5G

François Brunier (Soitec, France), Alexandre Giry (CEA-Leti) and Fredrik Tillman (Ericcson)

 

j) Compound semiconductor technologies for beyond 5G applications

Nadine Collaert (imec, Belgium)

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