Monday, September 3, 2018

12:30 pm - 2:00 pm (Room GER/0039/U).

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Pioneering Solutions for Wafer-Level Device, IC and System Characterization in the mmWave Range and Beyond

 

Instructors:

Andreas Henkel, Product Manager Vector Network Analysis, Rohde & Schwarz GmbH & Co. KG

Andrej Rumiantsev, Director RF Technologies, MPI Corporation

 

The automotive radar, self-driving cars and 5G applications are the key driving forces to extend semiconductor technologies to higher frequencies and bandwidths. Even in the mobile communications, frequency ranges up to 70 GHz to 80 GHz and beyond are considered for handheld devices or backhaul systems. However, challenges of obtaining accurate measurement results increase exponentially with the frequency range: active devices require precisely calibrated stimuli for magnitude, phase and power at the device level, e.g. to perform calibrated compression point measurements. Moreover, the majority of characterization tasks should be executed at the wafer-level. This drastically increases the complexity of the integrated measurement systems.

The workshop will start with an overview of specific requirements for measurement and calibration techniques. Later, we will introduce pioneering solutions for mm-wave device characterization, ICs and system measurements at the wafer-level: e.g. for on-chip antenna characterization as well as for THz measurements. Based on experience and expertise of R&S and MPI, complex and fully-integrated solutions were developed to help engineers obtaining most accurate and reliable results with highest confidence and in shortest time.

Attendees will also have an unique opportunity for a Q&A session with technology experts in informal way during the event.

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Please register for this event while registering for the Conference. 

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