​September 11-14, 2017

Overview

GENERAL PURPOSE OF THE CONFERENCE

The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The increasing level of integration for system-on-chip design made available by advances in semiconductor technology is, more than ever before, calling for a deeper interaction among technologists, device experts, IC designers and system designers. While keeping separate Technical Program Committees, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered for either conference are encouraged to attend any of the scheduled parallel sessions, regardless to which conference they belong.

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CONFERENCE HIGHLIGHTS

• ​4 Joint Plenary presentations

Udo-Martin Gómez

SVP Robert Bosch GmbH, Germany, Germany

Smart Connected Sensors – Enablers for the IoT

ABSTRACT & BIO

Gary Patton 

CTO GLOBALFOUNDRIES, USA

Unleashing Technology Solutions for a New Era of Connected Intelligence

ABSTRACT & BIO

Baher Haroun

Senior Fellow Texas Instruments, USA

Autonomous Vehicles Sensor Needs

ABSTRACT & BIO

Evangelos S. Eleftheriou

Fellow IBM Research, Switzerland

"In-memory Computing": Accelerating AI Applications

ABSTRACT & BIO

• ​3 ESSDERC keynote presentations

Shinichi Takagi 

University of Tokyo, Japan

MOS Device Technology using Alternative Channel Materials for Low Power Logic LSI

ABSTRACT & BIO

Louis Hutin 

CEA Leti, France

Si MOS Technology for Spin-Based Quantum Computing

ABSTRACT & BIO

Debbie G. Senesky 

Stanford University, USA

GaN for the Future

ABSTRACT & BIO

• ​3 ESSCIRC keynote presentations

Borivoje Nikolic  

University of California Berkeley , USA

Generating the Next Wave of Custom Silicon

ABSTRACT & BIO

Georg Sigl

TU München and Fraunhofer AISEC, Germany

Where Technology Meets Security: Key Storage and Data Separation for System-on-Chips

ABSTRACT & BIO

Aaron Partridge 

Chief Scientist SiTime Corp., USA

It Is Time for Time Itself to Come From Silicon

ABSTRACT & BIO

• Invited papers with overall coverage of all aspects of advanced devices and circuits
   

• Special Focus Sessions of FDSOI and Power Electronics
   

• Presentation of IEEE and ESSDERC/ESSCIRC Awards
   

• ESSDERC/ESSCIRC Gala Dinner on Wednesday, September 5, 2018
   

• Tutorials
  - The Future of Mobility: Reliability, Readiness & Robustness of Integrated Circuits
      Chapter 1: EOS & ESD
      Chapter 2: Reliability & Readiness of IC’s 
      Chapter 3: Mobility & Sensing
  - IC Design for Automotive
  - Ultra-Low Power Sensors for Condition Monitoring
   

• Workshops
  
  
  
  The working language of the conference is English.

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