SPICE Modeling in Verilog-a: Successes and Challenges
Colin McAndrew, NXP Semiconductors, Phoenix, AZ, USA

 

Advances in the Understanding of Microscopic Switching Mechanisms in ReRAM Devices
Benoît Sklénard, CEA Leti, MINATEC Campus, Grenoble, France

 

Material and Device Innovation Impact on Reliability for Scaled CMOS Technologies
Tanya Nigam, GLOBALFOUNDRIES, Santa Clara, CA, USA

 

Emerging Memory Technologies for High Density Applications
Giorgio Servalli, Micron Technology, Vimercate, Italy 

 

Ink-jet Printed 2D Crystal Heterostructures
Francesco Bonaccorso, Istituto Italiano di Tecnologia, Genova, Italy

 

Hybrid InGaAs/SiGe CMOS Circuits with 2D and 3D Monolithic Integration
Veeresh Deshpande, IBM Research Zurich, Switzerland

 

Microfluidic Technology: New Opportunities to Develop Physiologically Relevant in vitro Models
Séverine Le Gac, University of Twente, Enschede, The Netherlands

 

Dopant Diffusion and Segregation, Si-Ge Interdiffusion and Defect Engineering in SiGe Devices

Guangrui Xia, University of British Columbia, Vancouver, Canada