Invited Speakers 

SPICE Modeling in Verilog-a: Successes and Challenges
Colin McAndrew, NXP Semiconductors, Phoenix, AZ, USA


Advances in the Understanding of Microscopic Switching Mechanisms in ReRAM Devices
Benoît Sklénard, CEA Leti, MINATEC Campus, Grenoble, France


Material and Device Innovation Impact on Reliability for Scaled CMOS Technologies
Tanya Nigam, GLOBALFOUNDRIES, Santa Clara, CA, USA


Emerging Memory Technologies for High Density Applications
Giorgio Servalli, Micron Technology, Vimercate, Italy 


Ink-jet Printed 2D Crystal Heterostructures
Francesco Bonaccorso, Istituto Italiano di Tecnologia, Genova, Italy


Hybrid InGaAs/SiGe CMOS Circuits with 2D and 3D Monolithic Integration
Veeresh Deshpande, IBM Research Zurich, Switzerland


Microfluidic Technology: New Opportunities to Develop Physiologically Relevant in vitro Models
Séverine Le Gac, University of Twente, Enschede, The Netherlands


Dopant Diffusion and Segregation, Si-Ge Interdiffusion and Defect Engineering in SiGe Devices

Guangrui Xia, University of British Columbia, Vancouver, Canada